LOCTITE ABLESTIK 965-1L
fitur dan keuntungan
LOCTITE ABLESTIK 965-1L, Epoxy, Die attach
LOCTITE® ABLESTIK 965-1L is designed for bonding large die integrated circuits with mismatched coefficients of thermal expansion. It is designed for high speed, automated assembly operations.
- Electrically conductive
- Stress absorbing
- Low levels of contaminants
- Void-free bondline with minimal bleed
Dokumen dan Unduhan
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Informasi Teknis
| Aplikasi | Pelekat Die |
| Indeks Tiksotropik | 4.5 |
| Jadwal Pengerasan, @ 150.0 °C | 1.0 hr. |
| Kekuatan Geser Die Panas, 2 x 2 mm (80 x 80 mil) Si die on Ag/Cu LF | 0.6 kg-f |
| Kekuatan Geser Die RT, 2 x 2 mm (80 x 80 mil) Si die on Ag/Cu LF | 10.0 kg-f |
| Koefisien Muai Termal (CTE) | 50.0 ppm/°C |
| Koefisien Muai Termal (CTE), Above Tg | 190.0 ppm/°C |
| Konduktivitas Termal | 3.0 W/mK |
| Resistivitas Volume | ≤ 0.0005 Ohm cm |
| Suhu Transisi Kaca (Tg) | 72.0 °C |
| Tipe Pengeringan | Heat Cure |
| Viskositas, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 12000.0 mPa.s (cP) |
| Warna | Abu-Abu: Perak |
LOCTITE ABLESTIK 965-1L
LOCTITE ABLESTIK 965-1L, Epoxy, Die attach