LOCTITE ABLESTIK 8008MD
Terkenal sebagai ABLECOAT 8008MD
fitur dan keuntungan
LOCTITE ABLESTIK 8008MD, Proprietary Hybrid Chemistry, Die Attach
LOCTITE® ABLESTIK 8008MD adhesive is designed for medium die attach applications. This material can be applied to a wafer backside by stencil printing and then B-staged in an oven. The adhesive can then be cured after die attach in an in-line process. This material was originally released as RP-825-3C1.
- Electrically conductive
- Thermally conductive
- Low modulus
- Good substrate wetting
Dokumen dan Unduhan
Mencari TDS atau SDS dalam bahasa lain?
Informasi Teknis
| Aplikasi | Pelekat Die |
| Kekuatan Geser Die Panas | 2.7 kg-f |
| Konten Ionik yang Dapat Diekstrak, Kalium (K+) | 9.0 ppm |
| Konten Ionik yang Dapat Diekstrak, Klorida (Cl-) | 9.0 ppm |
| Konten Ionik yang Dapat Diekstrak, Natrium (Na+) | 9.0 ppm |
| Modulus Tensil, DMTA @ 250.0 °C | 440.0 N/mm² (63820.0 psi ) |
| Suhu Penyimpanan | -40.0 °C |
| Tipe Pengeringan | Heat Cure |
LOCTITE ABLESTIK 8008MD
LOCTITE ABLESTIK 8008MD, Proprietary Hybrid Chemistry, Die Attach