LOCTITE ABLESTIK 2600BT

fitur dan keuntungan

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LOCTITE ABLESTIK 2600BT, Thermal Management, Die Attach
LOCTITE® ABLESTIK 2600BT adhesive is designed for thermal management applications requiring high heat extraction from the die. This adhesive uses a unique suspension system containing silver and resin particles suspended in solvent carrier. Once the material is fully cured and the solvent is evaporated, the adhesive has an extremely high silver loading. LOCTITE ABLESTIK 2600BT adhesive provides very low thermal resistance between chip to case, nearing solder and eutectic-type materials.
  • High thermal conductivity
  • Improved spreadability
  • Improved dispensability
  • Yields consistent dot sizes with minimal or no tailing
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Dokumen dan Unduhan

Teknis Lembar Data
LOCTITE ABLESTIK 2600BT
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Informasi Teknis

Aplikasi Pelekat Die
Kekuatan Geser Die Panas 1.4 kg-f
Kekuatan Geser Die RT 10.0 kg-f
Koefisien Muai Termal (CTE) 40.0 ppm/°C
Konten Ionik yang Dapat Diekstrak, Kalium (K+) 5.0 ppm
Konten Ionik yang Dapat Diekstrak, Klorida (Cl-) 9.0 ppm
Konten Ionik yang Dapat Diekstrak, Natrium (Na+) 9.0 ppm
Tipe Pengeringan Heat Cure