LOCTITE ABLESTIK 2000
Terkenal sebagai ABLEBOND 2000 (3.6G)
fitur dan keuntungan
LOCTITE ABLESTIK 2000, Proprietary Hybrid Chemistry, Electrically Conductive Die Attach Adhesive
LOCTITE® ABLESTIK 2000 electrically conductive die attach adhesive is designed for Pb-free PBGA and Array BGA packaging. This product is able to withstand the high reflow temperatures necessary for Pb-free solders @ 260°C. It is suitable for die sizes up to 12.7 x 12.7 mm.
- Proprietary hybrid chemistry
- Pb-free applications
- Ultra-low moisture absorption
- High hot/wet adhesion
Dokumen dan Unduhan
Mencari TDS atau SDS dalam bahasa lain?
Informasi Teknis
| Aplikasi | Pelekat Die |
| Kekuatan Geser Die Panas | 8.0 kg-f |
| Kekuatan Geser Die RT | 16.0 kg-f |
| Koefisien Muai Termal (CTE) | 65.0 ppm/°C |
| Konten Ionik yang Dapat Diekstrak, Kalium (K+) | 1.0 ppm |
| Konten Ionik yang Dapat Diekstrak, Klorida (Cl-) | 1.0 ppm |
| Konten Ionik yang Dapat Diekstrak, Natrium (Na+) | 1.0 ppm |
| Modulus Tensil, DMTA @ 250.0 °C | 193.0 N/mm² (28000.0 psi ) |
| Tipe Pengeringan | Heat Cure |
LOCTITE ABLESTIK 2000
LOCTITE ABLESTIK 2000, Proprietary Hybrid Chemistry, Electrically Conductive Die Attach Adhesive