Ultra-High Thermal Conductivity, Heat-Dissipating Gel Meets Processing, Performance Demands for High Bandwidth 5G Telecom Infrastructure Systems

Henkel Solutions and Results

• Henkel has developed a 10.0 W/m-K gel TIM that offers higher thermal conductivity than its predecessor but, remarkably, also has a nearly 30% increased flow rate as demonstrated by a simple cartridge dispense test. Formulating a material of this caliber that provides comprehensive performance and processing capability – high conductivity and excellent/stable dispensability -- is exceptional. 
• In rheology (dispensability) testing, Henkel’s BERGQUIST LIQUI FORM TLF 10000 outperformed other evaluated materials.  
• BERGQUIST LIQUI FORM TLF 10000 gel TIM satisfies the intense heat dissipation requirements of new high bandwidth industrial infrastructure systems, including telecom and datacom applications. The formulation balances high thermal conductivity, low stress, automated dispensability, production consistency and in-application stability. 
• Among the material’s many benefits, and specific to this active antenna application, are: 
• Thermal conductivity of 10.0 W/m-K provides high heat dissipation for state-of-the-art 5G systems.
• Pre-cured liquid gel requires no mixing or refrigeration, provides easy storage and handling. 
• High gap stability @ 1.5 mm for more than 2,500 hrs., with capability for larger gaps
• Withstands stress, movement, various CTE tolerances, fluctuating operational states (peak use) of heat and external environmental conditions. 
• Has excellent thermal cycling performance for high reliability.
• Optimized rheology for excellent, consistent dispensing performance to enable high-confidence mass production. 
• Due to its excellent processability in combination with ultra-high thermal conductivity, BERGQUIST LIQUI FORM TLF 10000 has been qualified for this new massive MIMO active antenna. The material has also been qualified for applications in the automotive ADAS sector.