BERGQUIST® GAP PAD® TGP 2200SF

Features and Benefits

A green, silicone-free gap-filling polymer for silicone-sensitive applications.
BERGQUIST® GAP PAD TGP 2200SF is a thermally conductive, electrically isolating polymer, ideal for silicone-sensitive applications with uneven topologies and high stack-up tolerances, typically digital disk drives and fiber optics modules. BERGQUIST GAP PAD TGP 2200SF is reinforced with fiberglass for easy material handling and added durability during assembly. It has reduced tack on one side, allowing for burn-in processes and easy rework.
  • Silicone-free
  • Service/operating temperature: -60°C to 125°C (-76°F to 257°F)
  • Electrically isolating
  • Thermal conductivity: 2.0 W/m-K
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Technical Information

Color Green
Operating temperature -60.0 - 125.0 °C
Shelf life 12.0 mon.
Standard thickness 0.254 - 3.175 mm
Storage temperature 25.0 °C
Thermal conductivity 2.0 W/mK
Resin
Carrier type, Resin Fiberglass

Frequently Asked Questions