LOCTITE® ABLESTIK 3230
Features and Benefits
LOCTITE ABLESTIK 3230, Epoxy, Die Attach
LOCTITE® ABLESTIK 3230 electrically conductive die attach adhesive is designed for high reliability package applications. It can be used in a variety of package sizes.
Read More
Documents and Downloads
Looking for a TDS or SDS in another language?
Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 80.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 205.0 ppm/°C |
| Color | Silver |
| Cure schedule, Alternate ≤ 175.0 °C 40 min. ramp | 55.0 min. |
| Cure schedule, Recommended @ 175.0 °C 30 min. ramp | 45.0 min. |
| Cure type | Heat cure |
| Glass transition temperature (Tg) | 37.0 °C |
| RT die shear strength, 2 x 2 mm, Si die Ag/Cu LF | 15.0 kg-f |
| Thixotropic index | 5.6 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 9500.0 mPa·s (cP) |
| Volume resistivity | 0.05 Ohm cm |
LOCTITE® ABLESTIK 3230
LOCTITE ABLESTIK 3230, Epoxy, Die Attach