LOCTITE® ECCOBOND LUX 3042M

功能与优点

Electrically non-conductive adhesive designed for use in the assembly of temperature-sensitive electronic components. A dual cure system allows for maximum performance.
For good electrically non-conductive adhesion to a variety of substrates, try LOCTITE® ECCOBOND LUX 3042M. This dual cure adhesive is specially designed for assembling temperature sensitive electronic components, and is formulated to initially cure when exposed to UV light, followed by a secondary thermal cure for maximum performance.
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技术信息

储存温度 -40.0 °C
固化方式 热+紫外线
固化时间, @ 120.0 °C 30.0 分钟
固化时间光强度 100.0 mW/cm²
粘度, Cone 20 mm, Angle 2° Spindle TA, Shear Rate 15 s⁻¹ 85000.0 mPa.s (cP)
组分数量 单组份
触变指数 1.2