BERGQUIST® GAP PAD® TGP 1300
Conocido como Gap Pad® 1500S30
Características y Ventajas
BERGQUIST GAP PAD TGP 1300, Highly Conformable, Thermally Conductive, Reinforced “S-Class” Gap Filling Material
BERGQUIST® GAP PAD® TGP 1300 is a highly compliant Gap Pad material that is ideal for fragile component leads. The material is fiberglass reinforced for improved puncture resistance and handling characteristics.BERGQUIST GAP PAD 1500S30 maintains a conformable, yet elastic nature that provides excellent interfacing and wet-out characteristics, even to surfaces with high roughness or uneven topography. BERGQUIST GAP PAD 1500S30 features an inherent tack on both sides of the material, eliminating the need for thermally impeding adhesive layers.Options and ConfigurationsStandard sheet size - 8" x 16" or custom configurationStandard thickness available - 0.020", 0.040", 0.060", 0.080", 0.100", 0.125", 0.160", 0.200", 0.250"Custom made configurations available upon request
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Información técnica
| Capacidad calorífica, ASTM E1269 | 1.0 J/g-K |
| Color | Rosado claro |
| Conductividad térmica | 1.3 W/mK |
| Constante dieléctrica, @ 1kHz | 5.0 |
| Densidad | 1.8 g/cm³ |
| Dureza shore, Thirty second delay value, ASTM D2240 Goma a granel Shore 00 | 30.0 |
| Espesor | 0.508 - 6.35 mm |
| Resistencia a la flama | V-0 |
| Resistividad de volumen | 1×10 Ohm m |
| Temperatura de funcionamiento | -60.0 - 200.0 °C |
| Tensión de ruptura dieléctrica | 6000.0 Vac |
BERGQUIST® GAP PAD® TGP 1300
BERGQUIST GAP PAD TGP 1300, Highly Conformable, Thermally Conductive, Reinforced “S-Class” Gap Filling Material