LOCTITE® CB 3626MHF
Características y Ventajas
LOCTITE CB 3626MHF, Epoxy, Component assembly, NCA, Surface mount adhesive
LOCTITE® CB 3626MHF is designed for bonding of surface mounted devices to printed circuit boards prior to wave soldering. This material is formulated to give excellent dot size and shape control when applied with a stencil using hand print or machine print process.
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Información técnica
| Forma física | Gel |
| Número de componentes | Monocomponente |
| Programa de curado, @ 130.0 °C | 120.0 s |
| Resistencia al corte, Acero (granallado) | 2610.0 psi |
| Temperatura de almacenaje | 2.0 - 8.0 °C |
| Tipo de curado | Curado Térmico |
LOCTITE® CB 3626MHF
LOCTITE CB 3626MHF, Epoxy, Component assembly, NCA, Surface mount adhesive