Phase Change Materials

HI-FLOW handles like BERGQUIST SIL PAD materials at room temperature, but flows like grease at its designed phase change temperature. The following is an overview of the important features shared by the HI-FLOW family:

• Comparable thermal performance to grease in most applications
• Thermally conductive phase change compound
• Aluminum, film or fiberglass carriers and non-reinforced versions
• Low volatility
• Easy to handle and apply in the manufacturing environment
• Tackified or tack-free at room temperature

Using HI-FLOW materials instead of grease can save time and money without sacrificing thermal performance. There are numerous benefits including:

• No mess – thixotropic characteristics of the materials keep it from flowing out of the interface
• Easier handling – tackified or tack-free at room temperature
• No protective liner required
• High thermal performance helps ensure CPU reliability
• Do not attract contaminants
• Easier material handling and shipping
• Simplified application process

The broad HI-FLOW family offers a variety of choices to meet performance, handling and process needs. Some of the choices include:

• Some HI-FLOW materials are available with or without adhesive
• Aluminum carrier for applications not requiring electrical isolation
• Film or fiberglass carrier for electrical isolation
• Dry, non-reinforced material
• Tackified or tack-free at room temperature
• Tabbed parts, die-cut parts, sheets or bulk rolls
• Adhesive specifically for cold application without preheating heat sink
• Customized options are available. Tooling charges vary depending on the complexity of the part.

HI-FLOW materials are suited for consumer and industrial electronics, automotive, medical, aerospace and telecommunications applications such as:

• UPS and SMPS AC/DC, DC/ DC or linear power supplies
• Between a CPU and heatsink
• Power conversion devices
• Fractional and integral motor control
• Leaded, surface mount and power module assemblies