BERGQUIST® GAP FILLER TGF 4000
Features and Benefits
This highly thermally-conductive liquid gap filler offers easy, precision dispensing, low stress assembly, and excellent low and high temperature, mechanical and chemical stability.
BERGQUIST GAP FILLER TGF 4000 is a 2-part, highly thermally conductive liquid gap filler. The mixed system will cure at room temperature, or faster with the addition of heat. It offers an extended working time to allow greater flexibility in the assembly process and, unlike cured thermal pad materials, a liquid offers infinite thickness variations with little or no stress to the sensitive components during assembly. You can also expect low level natural tack. Once cured, this product provides a soft, thermally conductive, form-in place elastomer ideal for fragile assemblies and filling unique and intricate air voids and gaps.
- Thermal conductivity: 4.0 W/m-K
- Ultra-conforming with excellent wet-out
- 100% solids - no cure byproducts
- Extended working time for manufacturing flexibility
Documents and Downloads
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Additional Documents
Technical Information
| Cure type | Heat cure |
| Flame rating | V-0 |
| Operating temperature | -60.0 - 200.0 °C |
| Thermal conductivity | 4.0 W/mK |
| Mixed | |
| Colour, Mixed | Blue |
| Resin | |
| Colour, Resin | Blue |
| Hardener | |
| Colour, Hardener | White |
BERGQUIST® GAP FILLER TGF 4000
This highly thermally-conductive liquid gap filler offers easy, precision dispensing, low stress assembly, and excellent low and high temperature, mechanical and chemical stability.