LOCTITE® ABLESTIK ABP 2450
Features and Benefits
LOCTITE ABLESTIK ABP 2450, BMI Hybrid, Heat cure
LOCTITE® ABLESTIK ABP 2450 die attach is formulated for use in high brightness LED manufacturing applications. This material is formulated to have a low moisture uptake and high light stability performance to extend LED lamp product life.
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 61.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 118.0 ppm/°C |
| Cure type | Heat cure |
| Glass transition temperature (Tg) | 67.0 °C |
| Thixotropic index | 5.5 |
| Viscosity, Brookfield DV-II, @ 25.0 °C Speed 5 rpm | 14000.0 mPa·s (cP) |
LOCTITE® ABLESTIK ABP 2450
LOCTITE ABLESTIK ABP 2450, BMI Hybrid, Heat cure