LOCTITE® STYCAST US 0152
Features and Benefits
LOCTITE STYCAST US 0152, Urethane, Potting and Encapsulating
LOCTITE® STYCAST US 0152 is an unfilled, low viscosity, reenterable potting and encapsulation compound. It has excellent low temperature properties and surface finish. This material can be used to encapsulate electronics for various applications including under-the-hood automotive and marine. The low glass transition temperature prevents damage to sensitive components during low temperature excursions. Please refer to the TDS for alternate cure schedules.
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Technical Information
| Applications | Encapsulating |
| Cure schedule, Alternate @ 60.0 - 85.0 °C | 2.0 - 4.0 hr. |
| Cure schedule, Recommended @ 23.0 °C | 24.0 hr. |
| Cure type | Heat cure |
| Density | 1.0 g/cm³ |
| Glass transition temperature (Tg) | -38.0 °C |
| Mix ratio, by volume | 52 : 100 |
| Mix ratio, by weight | 1 : 2 |
| Number of components | 2 part |
| Physical form | Liquid |
| Shore hardness, Shore A | 35.0 |
| Storage temperature | 20.0 - 30.0 °C |
| Tensile strength | 100.0 psi |
| Thermal conductivity | 0.172 W/mK |
| Viscosity, @ 23.0 °C | 450.0 mPa·s (cP) |
| Volume resistivity | 1.9x10¹¹ Ohm cm |
| Mixed | |
| Color, Mixed | Opaque |
| Resin | |
| Color, Resin | Amber |
| Hardener | |
| Color, Hardener | Black |
LOCTITE® STYCAST US 0152
LOCTITE STYCAST US 0152, Urethane, Potting and Encapsulating