Thermal Gel
Enhanced thermal conductivity through highly conformable gap filling capability
Thermally conductive gels, available in liquid formable and curable formulations, provide low component stress, rework simplicity, process flexibility, in-application stability and efficient thermal conductivity. These heat dissipation gels are effective across industrial and automotive applications.
Thermal Gels for Industrial Applications: Bergquist Liqui Form TLF thermal interface gels are high thermal conductivity liquid formable materials that can be automatically dispensed, provide low component stresses during assembly and simplify rework processes. The highly-conformable, shear-thinning materials require no curing, no mixing or refrigeration, streamlining storage, handling and processing. The unique chemistry platform delivers excellent thermal performance, low applied stress and reliable long-term performance. Thixotropic with a natural tack, Bergquist Liqui Form TLF materials conform to the component and remain in place within the application.
Thermal Gels for Automotive Applications: Designed for demanding, high reliability environments, Bergquist Liqui Form TLF CGels provide form-in-place functionality via moisture or thermal cure. Upon cure, the one-part thermal gels provide a soft, thermally conductive material capable of reducing air voids and gaps. Bergquist TLF CGels have been uniquely designed to deliver highly reliable vertical gap stability even in an uncured state. With no mixing required and good dispensing efficiency, Bergquist Liqui Form TLF CGels enable high throughput mass production while providing the assurance of reliability due to their cure-in-place final modulus. These Henkel thermal gels have passed severe hazing and fogging testing, making them exceptionally well-suited for optical systems such as ADAS cameras and lidars.
