LOCTITE® ABLESTIK 2025DSI

Features and Benefits

LOCTITE ABLESTIK 2025DSI, Proprietary Hybrid Chemistry, Die Attach
LOCTITE® ABLESTIK 2025DSI die attach adhesive is designed for use in array packaging.
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Technical Information

Applications Die attach
Coefficient of thermal expansion (CTE) 55.0 ppm/°C
Coefficient of thermal expansion (CTE), Above Tg 145.0 ppm/°C
Cure type Heat cure
Glass transition temperature (Tg) -34.0 °C
Thermal conductivity 0.4 W/mK
Thixotropic index 5.0
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm 11500.0 mPa·s (cP)