COVID-19 Update

Henkel corporate provides some information regarding Henkel and COVID-19.

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LOCTITE ABLESTIK QMI529HT

Features and Benefits

LOCTITE ABLESTIK QMI529HT, BMI/Acrylate, Die attach
LOCTITE® ABLESTIK QMI529HT die attach paste was developed as a soft-solder replacement or for high UPH performance applications. Maximum productivity is realized through in-line cure, either on the diebonder using a post diebond heater or on the wirebonder preheater.
  • Electrically conductive
  • Thermally conductive
  • Void-free bondline
  • Hydrophobic
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Technical Information

Applications Die Attach
CTEa1 (Below Tg) 53 ppm/°C
Cure Type Heat Cure