LOCTITE® ABLESTIK 2035SC

Features and Benefits

This 1-part electrically non-conductive adhesive has been specially formulated for use in high throughput die attach applications. It has a fast cure at a low cure temperature.
When you’re working with dissimilar surfaces and need a non-conductive adhesive, LOCTITE® ABLESTIK 2035SC is a good choice. This 1-part adhesive is formulated for use in high throughput die attach applications, and is designed to minimize stress and resulting warpage between dissimilar surfaces. You can expect a 90-second cure at 110°C (230°F).
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Technical Information

Applications Die Attach
Coefficient of thermal expansion (CTE) 54.0 ppm/°C
Coefficient of thermal expansion (CTE), Above Tg 128.0 ppm/°C
Cure schedule, Recommended @ 110.0 °C 90.0 sec.
Cure type Heat Cure
Extractable ionic content, Chloride (CI-) 29.0 ppm
Extractable ionic content, Potassium (K+) 19.0 ppm
Extractable ionic content, Sodium (Na+) 89.0 ppm
Glass transition temperature (Tg) 120.0 °C
Hot die shear strength 7.0 kg-f
Key characteristics Conductivity: Electrically Non-Conductive
RT die shear strength 25.0 kg-f
Tensile modulus, DMTA @ 25.0 °C 68.0 N/mm² (10000.0 psi )
Thermal conductivity 0.35 W/mK
Thixotropic index 4.2
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm 11000.0 mPa·s (cP)