Ensuring high thermal transfer on an interface, alongside superior surface wetting and minimal bondline thicknesses
For manufacturers with a preference for traditional thermal greases, Henkel has several RoHS-compliant formulations. Used in high-performance applications where a small bondline thickness is essential for high-thermal performance, Henkel's BERGQUIST® greases offer immediate functionality upon application. In addition, greases have a tendency to compensate for voids easily, so they are a particularly viable solution for devices that have flatness or coplanarity issues.
Available in cartridges or bulk containers, Henkel’s thermal greases include high-performance, high-temperature reliability, silicone-free and water-cleanable formulas
Thermal Interface Compounds (TIC)
Henkel’s BERGQUIST line of thermally conductive thermal interface compounds (TIC) will flow under assembly pressure to wet-out the thermal interface surfaces and produce very low thermal impedance. TIC products are designed for use between a high-end computer processor and a heat sink or other high watt density applications.
Alternatives to Thermal Grease
Henkel’s HI-FLOW Phase Change materials are not only an effective alternative for thermal greases, their thixotropic characteristics ensure they are solid at room temperature and won’t flow out of an interface at operational temperature.
To learn more about Henkel’s line of thermal grease alternatives, click here.
Applications and Industries
Resources for Thermally Conductive Grease
Brochure: Thermal Management Materials
Selection Guide: Thermal Interface Materials
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