Henkel's award-winning room temperature stable and high reliability 90iSC solder pastes are highly regarded for their processability, performance, and reliability. Built on decades of formulation innovation, LOCTITE® brand solder materials are guaranteed conflict-free and it is RoHS, REACH, and EICC compliant to ensure sustainability through temperature stable and halogen-free flux chemistry platforms and deliver robust electrical interconnections essential for modern-day electronics.

Whether its automotive electronics, 5G infrastructure and handsets, medical devicesindustrial power and automation, industrial lighting, aerospace and satellite applications, or consumer electronics, Henkel has the solder paste material to meet your needs.

With zero deliberately added halogens and integrating the purest raw materials available, Henkel’s halogen-free formulations are, indeed, halogen-free. We take our obligation to advanced materials development so seriously that Henkel has pledged to ensure all future solder paste formulations are either halogen-free, temperature stable, or both.

Determine Henkel's soldering solution for your application

Are you looking for the right solder paste material for your application? Discover our solder paste product selector and find your solution in 6 easy steps:

Contact a member of our team to find out more about our solder paste product line.

LOCTITE® GC Temperature Stable Solder Paste – The Game Changers

Multi-award-winning LOCTITE® GC solder pastes have forever changed the electronics assembly soldering game. This uniquely room temperature stable halogen free flux chemistry delivers improved process, reliability, and sustainability metrics. Temperature stable throughout the logistics and operations value chains, LOCTITE® GC no-clean, halogen-free, and lead-free materials provide users with performance and cost-saving advantages on and off the production line, overcoming the drawbacks of conventional PB-free solder paste materials.

LOCTITE® GC 18 is the latest product in the room temperature stable portfolio. This innovative SAC solder paste consistently aid to control very low solder voids specially for soldering components with large thermal pad area, such as Bottom Terminated Components (QFN, MLF, LGA), Dpak, and LEDs.

Sustainability is built into LOCTITE® GC 18 as it facilitates the elimination of costly nitrogen reflow processes, reduces rework, lowers processing costs, and cuts PPM defects.

Temperature Stable Solder Paste Jetting

Solder paste jetting allows for a much quicker application process, saving both time and production costs. Moreover, LOCTITE® GC products are designed to help improve stability in jetting processes. Leveraging LOCTITE® GC solder paste technology, Henkel has developed a temperature stable solder paste capable of jetting repeatable solder deposits and delivering lifetime inside the jetting ejector system at temperatures up to 28°C and allows for storage up to 12 months without impacting long-term reliability. This is also ideally suited for pin in paste soldering applications where the solder material is dispensed through holes onto the substrate.

If dispensing process is required, Henkel offers halogen free solder pastes in different powder particle sizes, including type 3, type 4, and type 5.

Learn more about LOCTITE® GC Temperature Stable Solder Paste portfolio here

Printing Process Capability

With several printing processes and dispensing methods available to manufacturers, solder paste must allow for a wide range of process capabilities. LOCTITE® solder pastes provide flexibility and stability across applications and dispensing processes.  

High Solder Joint Reliability Lead Free Alloy

Henkel’s 90iSC alloy was designed for applications and markets where extreme temperature resistance and reliability are non-negotiable and lead-free compliance is required. When traditional SAC alloys can’t deliver safety-critical performance, Henkel’s 90iSC alloy is the answer. Tough, durable, adaptable, and high-temperature capable, 90iSC alloy is the lead-free benchmark for high reliability applications. 90iSC alloy has the ability to provide high creep and strain resistance within operating temperatures up to 150°C.

When subjected to thermal cycling, thermal shock, and thermal ageing, 90iSC alloy is unmatched. This, in combination with its solderability when integrated with the appropriate flux system, makes 90iSC alloy the world’s leading high reliability, lead-free, and RoHS-compliant solder alloy.

Henkel offers a complete range of LOCTITE® solder paste solutions in the 90iSC alloy which are capable of exceeding the challenges of harsh environments as well as being compliant with the automotive engineering test MS184-01 for high stress components. As excessive growth of intermetallic compounds affects the mechanical integrity of solder joints negatively due to their brittle behavior, 90iSC alloy permits maintaining a stable interconnection with more than 75% original solder joint strength after thermal cycling.

SIR Reliability

LOCTITE® solder pastes offer a large range of halogen-free, no-clean solder paste solutions, leaving reduced amounts of residues with high surface insulation resistance (SIR) all without compromising long term reliability and electrochemical migration risks, including pin-in-paste soldered areas.

Residues are transparent and cosmetically compliant with industry requirements. The flux residues can be easily cleaned and removed with mainstream electronics cleaning solutions.

Materials Compatibility

Interactions between different materials is a key concern in electronics assembly. New electronics designs demand larger use of encapsulation underfills, conformal coatings, and thermal dissipation materials to achieve board-level reliability and expected operational performance. The unique experience of Henkel across a broad materials portfolio becomes a strength to assess materials compatibility with solder paste residues.

Alternative Lead Free and Tin Lead Alloys

The breadth of Henkel’s line of solder alloys is unmatched, providing customers with expansive options to address various process and product conditions. From traditional SnPb to Pb-free and high-reliability Pb-free, our alloy portfolio delivers solutions for numerous applications. Henkel offers a large range of Pb-free solder alloys including industry standard SAC alloy, 90iSC high reliability alloy, SnAg alloy, SnSb high melting point alloy, and SnBi low melting point alloy, all of which meet industry specifications. For electronic assemblies requiring low temperature solder where both sensitive components, substrates, or needing to maintain temperature hierarchy are on the assembly board, Tin-Bismuth based solutions often preferred.

For applications that require tin-lead materials, Henkel’s portfolio of leaded solder alloys in combination with a variety of flux chemistries offers multiple solutions for PCB assembly and semiconductor packaging.

Die Attach Solder Paste

Die attach solder pastes from Henkel tackle the high thermal requirements of next-generation semiconductor packages where high operating temperatures and harsh environments require high melt point materials. Multiple flux formulas provide packaging specialists with many options and the ability to select various alloys that align with application requirements. Flux systems that support high-lead and lead-free options are available to comply with both RoHS and reliability requirements.

Electrically Conductive die attach pastes

Addressing the requirements for both laminate and leadframe wirebond packages, Henkel has developed a comprehensive portfolio of advanced conductive die attach materials for various wirebond requirements – from smaller die-to-pad ratios to thinner bond lines to low stress to high temperature capability and robust adhesion.

As the market share leader and top innovator of the most advanced die attach solutions, the LOCTITE® ABLESTIK® portfolio delivers exceptional die packaging reliability performance and meets the highest JEDEC MSL standards.

Sintering and semi-sintering pastes

Smaller, higher functioning devices within applications in various market sectors are increasing power densities and driving the need for more effective heat dissipation. While thermal interface materials offer this capability at the board and component level, more user-friendly and effective thermal management solutions are needed at the die level.

Henkel's new series of high thermal semi-sintering die attach materials enable robust package-level sintering and overcome the regulatory challenges of solder, thermal conductivity limitations of traditional die attach materials, and processability complexities of pure sintering pastes. The LOCTITE® ABLESTIK® ABP 8068T portfolio are high thermal, semi-sintering die attach pastes that offer simplified processing, and best-in-class thermal and electrical performance with robust reliability for today’s high-power density devices.

Further Resources

For more information on Henkel’s solder paste product range, download the PDFs here. Alternatively, contact us today for more TDS and SDS sheets or to ask any questions.

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