Chip-on-board materials that offer excellent temperature stability, good thermal shock resistance, outstanding electrical insulation at both room and elevated temperatures, minimal shrinkage during cure, low stress and excellent chemical resistance
Henkel’s line of LOCTITE and LOCTITE Eccobond™ encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. They are developed to provide protection to wire bonds, leads and aluminum.
Available as thermal, ultraviolet (UV), or moisture cure materials, Henkel encapsulants are designed for the highest reliability using:
Henkel high-purity encapsulants deliver unmatched performance for a variety of products including transistors, system in package (SIP) devices, ASICs, and chip-on-board applications. Cycle time and costs can be reduced through the use of LOCTITE ECCOBOND glob tops. These materials for chip-on- board applications are designed to cure quickly to fit easily within high-speed manufacturing operations.
Like all Henkel materials, LOCTITE ECCOBOND liquid encapsulants are formulated and tested in-process and in the context of full package assembly. They meet the most stringent JEDEC-level testing requirements and are developed to deliver outstanding performance within high temperature lead-free environments.
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