Die attach film adhesives are used for specific electronic manufacturing applications since they are easier to apply in a uniformed fashion across a substrate. With advances in electronic devices requiring smaller and high-performing materials, there is a growing need for die attach film adhesives that both are thin and quick curing as well as applied easily in small spaces. Henkel’s die attach film adhesives are up to the challenges for leadframe and wirebond semiconductor packaging in the electronics industry.
Henkel’s LOCTITE® ABLESTIK® conductive die attach film (CDAF) and non-conductive die attach films (nCDAF) are leading the way in enabling customers to design products with controlled bondlines. Designers using Henkel’s die attach film adhesives are better able to control uniformity of bondline thickness and eliminate die attach fillets commonly found when using paste adhesives. Our die attach film adhesives also offer fast curing times for applications that require quick bonding.
Contact us today to find out more about our entire line of die attach film adhesives.