Die attach film adhesives are used for specific electronic manufacturing applications since they are easier to apply in a uniformed fashion across a substrate. With advances in electronic devices requiring smaller and high-performing materials, there is a growing need for die attach film adhesives that both are thin and quick curing as well as applied easily in small spaces. Henkel’s die attach film adhesives are up to the challenges for leadframe and wirebond semiconductor packaging in the electronics industry.   

Henkel’s LOCTITE® ABLESTIK® conductive die attach film (CDAF) and non-conductive die attach films (nCDAF) are leading the way in enabling customers to design products with controlled bondlines. Designers using Henkel’s die attach film adhesives are better able to control uniformity of bondline thickness and eliminate die attach fillets commonly found when using paste adhesives. Our die attach film adhesives also offer fast curing times for applications that require quick bonding.

Contact us today to find out more about our entire line of die attach film adhesives.

Die Attach Film Adhesives Types

LOCTITE® ABLESTIK® is the trusted brand when it comes to die attach films and other materials. With an increasing demand for high-quality wireframe IC materials, our product portfolio is up the challenges that face electronics manufacturing. In order to meet the demand for thin die attach adhesives that don’t need dispensing equipment, we offer both conductive and non-conductive die attach films.

Conductive Die Attach Film (CDAF)

LOCTITE® ABLESTIK® conductive die attach films (CDAF) allow wirebond IC package manufacturers the same process advantages offered by non-conductive die attach film processes: controlled fillets, controlled bondlines, elimination of die tilt, and better design latitude with the elimination of the die attach fillet. Consumers continue to demand smaller and more capable devices, and Henkel’s CDAF materials are making this ongoing product evolution possible. 

Henkel was the first to develop and introduce conductive die attach film (CDAF) to the semiconductor market. A groundbreaking market development, this innovation was viewed by the semiconductor industry as a significant enabling technology to produce more capable and cost-effective wirebond IC package designs. Indeed, this has been the result, as numerous semiconductor packaging specialists have leveraged Henkel’s CDAF advantages for new and better package designs.

LOCTITE® ABLESTIK® CDF100 was the premier material in Henkel’s CDAF line and, since then, we have also developed second-generation pre-cut and dicing tape materials that have expanded the suite of conductive films to address various leadframe and laminate package requirements. Each material offers different properties and characteristics – from dicing die attach capability to varying thermal and electrical performance to cost competitiveness – but all of them deliver the undeniable advantages of film-based materials over that of conventional die attach paste.d challenging keep out zones of miniaturized package designs dictate controlled flow films versus dispensed pastes and Henkel’s high-reliability conductive die attach films deliver.  Facilitating reduced package footprints, shorter interconnections, faster signal speeds, and lower cost of ownership, Henkel two-in-one conductive die attach films satisfy numerous leadframe and laminate package application requirements.  

Conductive Die Attach Film for Leadframe Packages

*Table does not list the complete portfolio, please contact your sales/technical representative for additional product recommendations

Consumers continue to demand smaller and more capable devices, and Henkel’s CDAF materials are making this ongoing product evolution possible.

Market Trends Limitations with Die Attach Paste Henkel's CDAF Solutions
Miniaturized packages with increased die-to-pad ration (close to 1.0 in some cases) Fillet and bleed require minimum keep-out zone around the die and a consequently larger die pad size No fillet or bleed, allowing for smaller die pad size
Higher density, multi-die packages, such as SiP (LGA/PBGA) Package can fit fewer die with larger die pad sizes Ability to inetgrate more die per package due to tight clearance between the die and die pad
Thinner packages due to thinner die For thinner die, uneven fillet height can lead to kerf creep No fillet or kerf creep, facilitating thinner die handling
Thinner packages due to thinner bondlines Especially for smaller die, bondline control is challenging and leads to die tilt Unifrom and consistently thinner bondlines
Faster signal speed Longer interconnection hinders signal speed Shorter interconnection enables faster signal speed
Lower total cost of ownership due to materials Cost of extra Au wire, lead frame and EMC needed to accommodate larger die pad size Cost savings due to less Au wire, lead frame and EMC used
Lower total cost of ownership due to efficient processes Challenging to optimize dispense patterns for various die sizes (0.2mm to over 10mm x 10mm) No dispensing necessary with precut format in wide die size range

Non-Conductive Die Attach Film

The use of non-electrically conductive die attach films enables thin, uniform bondlines, reliable handling, and adaptable processing required for robust die-to-substrate and die-to-die bonding in next-generation wirebond packages used in memory device and other applications. With an extensive range of materials – including film-over-wire (FoW) and film-over-die (FoD) -- for multiple device structures, Henkel’s non-conductive die attach films accommodate various thickness requirements, cure mechanisms, wire and leadframe compatibility, multiple die sizes, and low warpage considerations.

Non-conductive die attach films combine dicing die attach tapes and film into a single product: dicing die attach film (DDF). Henkel’s DDFs enable packaging specialists using thinned die processes the added design latitude of designing processes with improved wafer stability, controlled bondlines, elimination of die tilt, and the ability to do away with the dispensing processes. Dicing die attach film is essential for new wafer coating processes that require a dual tape-film material solution.

Contact us today to find out more about our entire line of die attach film adhesives.

Industrial Applications

Our die attach film adhesives are used across industries, helping our customers manufacture lead frame packages and semiconductors that meet high industry standards. Discover the different industries where we provide high-quality die attach film solutions along with other material solutions.

Automotive

Die attach film adhesives are needed for many applications in the automotive industry such as the manufacturing of semiconductor packaging for dashboard displays and ADAS systems. To find out more about our specific product solutions for automotive, visit our automotive industry section.

Electronics

With a rapid advances in electronics technology, manufacturing require trusted suppliers for die attach film materials. Visit our electronics industry page to find out more about our specific product solutions.

Telecommunications

Die attach film adhesives are essential for a number of electronic products essential for telecommunications and 5G systems. To learn more about our adhesive and thermal management solutions for telecommunications, visit our telecommunications industry section.

Further Resources

Download the following PDFs to learn more about our die attach film adhesives and their applications.

Brochure: Conductive Die Attach Film

Brochure: Wirebond Packaging

Consumers continue to demand smaller and more capable devices, and Henkel’s CDAF materials are making this ongoing product evolution possible.

Market Trends Limitations with Die Attach Paste Henkel's CDAF Solutions
Miniaturized packages with increased die-to-pad ration (close to 1.0 in some cases) Fillet and bleed require minimum keep-out zone around the die and a consequently larger die pad size No fillet or bleed, allowing for smaller die pad size
Higher density, multi-die packages, such as SiP (LGA/PBGA) Package can fit fewer die with larger die pad sizes Ability to inetgrate more die per package due to tight clearance between the die and die pad
Thinner packages due to thinner die For thinner die, uneven fillet height can lead to kerf creep No fillet or kerf creep, facilitating thinner die handling
Thinner packages due to thinner bondlines Especially for smaller die, bondline control is challenging and leads to die tilt Unifrom and consistently thinner bondlines
Faster signal speed Longer interconnection hinders signal speed Shorter interconnection enables faster signal speed
Lower total cost of ownership due to materials Cost of extra Au wire, lead frame and EMC needed to accommodate larger die pad size Cost savings due to less Au wire, lead frame and EMC used
Lower total cost of ownership due to efficient processes Challenging to optimize dispense patterns for various die sizes (0.2mm to over 10mm x 10mm) No dispensing necessary with precut format in wide die size range

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