Henkel’s LOCTITE ABLESTIK conductive die attach film (CDAF) and non-conductive die attach films are leading the way in enabling customers to design products with controlled bondlines. Designers using Henkel’s die attach films are better able to control uniformity of bondline thickness and eliminate die attach fillets commonly found when using paste adhesives.

LOCTITE ABLESTIK conductive die attach films (CDAF) allow lead frame package manufacturers the same process advantages offered by non-conductive die attach film processes: controlled fillets, controlled bondlines, elimination of die tilt and better design latitude with the elimination of the die attach fillet.

Non-conductive die attach films combine dicing die attach tapes and film into a single product: dicing die attach film (DDF). Henkel’s DDFs enable packaging specialists using thinned die processes the added design latitude of designing processes with improved wafer stability, controlled bondlines, elimination of die tilt and the ability to do away with the dispensing processes.

Henkel's Conductive Die Attach Film (CDAF) Solutions

Henkel was the first to develop and introduce conductive die attach film (CDAF) to the semiconductor market. A groundbreaking market development, this innovation was viewed by the semiconductor industry as a significant enabling technology to produce more capable and cost-effective leadframe package designs. Indeed, this has been the result, as numerous semiconductor packaging specialists have leveraged Henkel’s CDAF advantages for new and better package designs.

LOCTITE ABLESTIK CDF100 was the premier material in Henkel’s CDAF line and, since then, we have also developed second-generation pre-cut and dicing tape materials that have expanded the suite of conductive films to address various leadframe and laminate package requirements. Each material offers different properties and characteristics – from dicing die attach capability to varying thermal and electrical performance to cost competitiveness – but all of them deliver the undeniable advantages of film-based materials over that of conventional die attach paste.

Consumers continue to demand smaller and more capable devices, and Henkel’s CDAF materials are making this ongoing product evolution possible.

Market Trends Limitations with Die Attach Paste Henkel's CDAF Solutions
Miniaturized packages with increased die-to-pad ration (close to 1.0 in some cases) Fillet and bleed require minimum keep-out zone around the die and a consequently larger die pad size No fillet or bleed, allowing for smaller die pad size
Higher density, multi-die packages, such as SiP (LGA/PBGA) Package can fit fewer die with larger die pad sizes Ability to inetgrate more die per package due to tight clearance between the die and die pad
Thinner packages due to thinner die For thinner die, uneven fillet height can lead to kerf creep No fillet or kerf creep, facilitating thinner die handling
Thinner packages due to thinner bondlines Especially for smaller die, bondline control is challenging and leads to die tilt Unifrom and consistently thinner bondlines
Faster signal speed Longer interconnection hinders signal speed Shorter interconnection enables faster signal speed
Lower total cost of ownership due to materials Cost of extra Au wire, lead frame and EMC needed to accommodate larger die pad size Cost savings due to less Au wire, lead frame and EMC used
Lower total cost of ownership due to efficient processes Challenging to optimize dispense patterns for various die sizes (0.2mm to over 10mm x 10mm) No dispensing necessary with precut format in wide die size range

Resources for Die Attach Film Adhesives

Brochure: Wirebond Packaging

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