To help manufacturers address the challenges within specific industries, Henkel has the most robust range of underfills. Our innovative capillary flow, edge, and corner bond underfills for CSP, BGA, WLCSP, LGA and other similar devices lower stress, improve reliability, and offers outstanding results.
Underfills are used in manufacturing delicate electronic packages for the automotive and electronics industries, among others. Underfills are also used to provide mechanical reinforcement to the solder joints and solder balls that connect a chip to a printed circuit board. The underfill reinforces the package to the board via capillary action. This helps to prevent mechanical fatigue and extend the lifespan of the assembly.
Henkel has developed a range of underfills, with each offering a particular property requirement. These underfills have been specially formulated to offer manufacturers a reliable, high-quality product. Using Henkel underfill solutions in the production of CSPs, BGAs, WLCSPs, and other components can enhance performance and improve the lifespan of a manufacture’s products.
Higher I/O counts, package integration, and tighter bump pitches are dictating the use of flip-chip technology to enable advanced package designs. Given these realities, protecting next-generation flip-chip and package-on- package (PoP) devices is more important than ever to safeguard against stress and ensure long-term function and reliability of the component Underfills in a variety of formats protect delicate, high-density flip-chip connections and Henkel’s capillary underfill (CUF) and non-conductive pastes and films (NCP and NCF) offer proven success.
Underfills are usually applied to the package after reflow. Traditional capillary underfills are dispensed to flow in between the solder balls of Ball Grid Arrays (BGAs) and Chip Scale Packages (CSPs) enhancing mechanical and thermal properties.
These products provide solutions to a number of challenges. Our underfills can be used to help reinforce electronic components and minimize stress. They also offer excellent protection of solder joints during thermal cycling.
Contact us to learn more about our high-quality underfills and to ask any industry specific questions about our product range.