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      A packshot of LOCTITE ECCOBOND UF 1173 showing black 10 and 55CC syringes.

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      Underfills

      LOCTITE® ECCOBOND UF 1173

      One-part, void-free, second level epoxy underfill

      Epoxy-based formulation for a uniform and void-free encapsulant underfill.

      All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

      Part no. (SKU/IDH)
      2420247

      LOCTITE® ECCOBOND UF 1173, 10 ml Syringe

      Documents

      Technical (1)

      RoHS (1)

      Regulatory (1)

      Information

      When you want a second-level underfill for void-free encapsulation of electronic packages, choose LOCTITE® ECCOBOND UF 1173. This 1-part, epoxy-based underfill maximizes the device's temperature cycling capability, distributing stress away from solder connects, thus enhancing solder joint reliability in CSP and BGA packages. LOCTITE® ECCOBOND UF 1173 has a long pot life and exhibits low-CTE properties to improve the bond strength and stability.
      • Void-free
      • Low coefficient of thermal expansion (CTE)
      • 48-hour pot life at 77°F (25°C)

      Color:

      Black

      Cure type:

      Heat cure

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