Underfills
One-part, black epoxy underfill for preventing mechanical stress
One-part, reworkable epoxy underfill for CSP and BGA production.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
1658529
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- Description
- Technical specification
If you want a reliable underfill for Ball Grid Array (BGA) and chip scale packaging (CSP), LOCTITE® 3517M is recommended. This black-liquid, epoxy-based underfill solution is designed for the production of CSPs and BGAs. LOCTITE® 3517M is particularly ideal for soldering joint protection against mechanical stress in hand-held electronic device applications.
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High reliability and reworkability
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Requires no mixing
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Low-halogen
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7-day pot life at 71.6°F (22°C)
Coefficient of thermal expansion (CTE):
65.0 ppm/°C
Coefficient of thermal expansion (CTE), Above Tg:
191.0 ppm/°C
Cure schedule light intensity:
30.0 mW/cm²
Cure schedule, Recommended, @ 120.0 °C:
5.0 min.
Glass transition temperature (Tg):
78.0 °C
Viscosity, Haake PK1.2:
2600.0 mPa·s (cP)
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Large volume or special order?
Order request{{#distributor.notOnShelf}} {{/distributor.notInStock}}{{#distributor.notInStock}}