Underfills
One-part, halogen-free epoxy underfill for shock and drop protection
Halogen-free epoxy underfill for curing during Pb-free solder reflow while allowing self-alignment of IC components.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
2892471
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- Description
- Technical specification
If you’re looking for a reliable underfill to protect electronic products from shock, drop, and vibration, consider LOCTITE® 3508NH. This black, 1-part epoxy-based underfill is designed to cure during Pb-free solder reflow while allowing self-alignment of integrated circuit (IC) components. Ultimately to improve the mechanical reliability of hand-held devices. LOCTITE® 3508NH can be pre-applied to the board at the corners of the pad site using a standard SMA dispenser.
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Eliminates post-reflow dispenses
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High reliability and reworkability
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Halogen-free
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Improves mechanical reliability of hand-held devices
Coefficient of thermal expansion (CTE):
65.0 ppm/°C
Coefficient of thermal expansion (CTE), Above Tg:
175.0 ppm/°C
Glass transition temperature (Tg):
118.0 °C
Viscosity, cone & plate, @ 25.0 °C:
70000.0 mPa·s (cP)
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Large volume or special order?
Order request{{#distributor.notOnShelf}} {{/distributor.notInStock}}{{#distributor.notInStock}}