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BERGQUIST GAP PAD TGP 800VO

Known as Gap Pad® VO

Features and Benefits

BERGQUIST GAP PAD TGP 800VO

BERGQUIST GAP PAD TGP 800VO, Conformable, Thermally Conductive Material for Filling Air Gaps

BERGQUIST® GAP PAD TGP 800VO is a cost-effective, thermally conductive interface material. The material is a filled, thermally conductive polymer supplied on a rubber-coated fiberglass carrier allowing for easy material handling. The conformable nature of BERGQUIST GAP PAD TGP 800VO allows the pad to fill in air gaps between PC boards and heat sinks or a metal chassis.
  • Thermal Conductivity: 0.8 W/m-K
  • Enhanced puncture, shear and tear resistance
  • Conformable gap filling material
  • Electrically isolating
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Documents and Downloads

Technical Information

Carrier Type Reinforcement Carrier: Sil-Pad
Color Gold
Flame Rating V-0
Technology Silicone
Thermal Conductivity 0.8 W/mK
Thickness Max 0.25
Thickness Min 0.02
Thickness Unit in.
Usage Temperature Max 392
Usage Temperature Min -77
Usage Temperature Unit °F
Young's Modulus 689 KPa