Known as Sil-Pad® 900S
Features and Benefits
BERGQUIST SIL PAD TSP 1600S, Fiberglass-reinforced, Silicone-based InsulatorThe true workhorse of the SIL PAD product family, BERGQUIST® SIL PAD TSP 1600S thermally conductive insulation material, is designed for a wide variety of applications requiring high thermal performance and electrical isolation. These applications also typically have low mounting pressures for component clamping. BERGQUIST SIL PAD TSP 1600S material combines a smooth and highly compliant surface characteristic with high thermal conductivity. These features optimize the thermal resistance properties at low pressure. Applications requiring low component clamping forces include discrete semiconductors (TO-220, TO-247 and TO-218) mounted with spring clips. Spring clips assist with quick assembly and apply a limited amount of force to the semiconductor. The smooth surface texture of BERGQUIST SIL PAD TSP 1600S minimizes interfacial thermal resistance and maximizes thermal performance.
- Thermal impedance: 0.61ºC-in2/W (@50 psi)
- Electrically isolating
- Low mounting pressures
- Smooth and highly compliant surface
- General-purpose thermal interface material solution
Documents and Downloads
Looking for a TDS or SDS in another language?
|Carrier Type||Reinforcement Carrier: Fiberglass|
|Thermal Conductivity||1.6 W/mK|
|Usage Temperature Max||356|
|Usage Temperature Min||-77|
|Usage Temperature Unit||°F|