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BERGQUIST SIL PAD TSP 1600S

Known as Sil-Pad® 900S

Features and Benefits

BERGQUIST SIL PAD TSP 1600S
BERGQUIST SIL PAD TSP 1600S, Fiberglass-reinforced, Silicone-based Insulator
The true workhorse of the SIL PAD product family, BERGQUIST® SIL PAD TSP 1600S thermally conductive insulation material, is designed for a wide variety of applications requiring high thermal performance and electrical isolation. These applications also typically have low mounting pressures for component clamping. BERGQUIST SIL PAD TSP 1600S material combines a smooth and highly compliant surface characteristic with high thermal conductivity. These features optimize the thermal resistance properties at low pressure. Applications requiring low component clamping forces include discrete semiconductors (TO-220, TO-247 and TO-218) mounted with spring clips. Spring clips assist with quick assembly and apply a limited amount of force to the semiconductor. The smooth surface texture of BERGQUIST SIL PAD TSP 1600S minimizes interfacial thermal resistance and maximizes thermal performance.
  • Thermal impedance: 0.61ºC-in2/W (@50 psi)
  • Electrically isolating
  • Low mounting pressures
  • Smooth and highly compliant surface
  • General-purpose thermal interface material solution
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Technical Information

Carrier Type Reinforcement Carrier: Fiberglass
Color Pink
Flame Rating V-0
Technology Silicone
Thermal Conductivity 1.6 W/mK
Thickness 0 in.
Usage Temperature -76 - 356 °F