BERGQUIST SIL PAD TSP Q2000
Known as Q-Pad® 3
Features and Benefits
BERGQUIST SIL PAD TSP Q2000, Fiberglass-Reinforced, Silicone based, Grease Replacement Thermal InterfaceBERGQUIST® SIL PAD TSP Q2000 eliminates problems associated with thermal grease such as contamination of electronic assemblies and reflow solder baths. BERGQUIST SIL PAD TSP Q2000 may be installed prior to soldering and cleaning without worry. When clamped between two surfaces, the elastomer conforms to surface textures thereby creating and air-free interface between heat-generating components and heat sinks. Fiberglass reinforcement enables BERGQUIST SIL PAD TSP Q2000 to withstand processing stresses without losing physical integrity. It also provides ease of handling during application.
- Thermal impedance: 0.35°C-in2/W (@50 psi)
- Eliminates processing constraints typically associated with grease
- Conforms to surface textures
- Easy handling
- May be installed prior to soldering and cleaning without worry
Documents and Downloads
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|Carrier Type||Reinforcement Carrier: Fiberglass|
|Thermal Conductivity||0.2 W/mK|
|Usage Temperature||-76 - 356 °F|