Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal GAP PAD Materials

BERGQUIST® GAP PAD TGP 1000VOUS

Ultra soft, fibreglass reinforced insulation pad - high voltage applications

Thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 1.0 W/m-K and ultra conformable behaviour.

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Documents

Information

BERGQUIST® GAP PAD TGP 1000VOUS is a pre-cured and electrically insulating material with a “gel-like” modulus that provides shock absorbing and low stress vibration dampening characteristics. This product is recommended for applications that require isolation between heat sinks and high-voltage, bare-leaded devices. Ideal for filling air gaps in high voltage devices.

For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.

Carrier type:

Fiberglass

Color:

Pink

Operating temperature:

-60.0 °C - 200.0 °C

Standard thickness:

0.508 mm - 6.35 mm

Thermal conductivity:

1.0 W/mK

Young's modulus, ASTM D575:

55.0 KPa (8.0 psi)

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