Thermal GAP PAD Materials
Reworkable, thermally-conductive gap pad for fragile components
This silicone, thermally-conductive and reworkable gap pad is highly conformable, easily compressable, and is reinforced with a PEN film for rework and improved resistance to puncture and tear.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
When you need a thermally conductive gap pad for fragile components, try BERGQUIST® GAP PAD TGP 1350. This silicone-based pad is highly conformable and compliant, and reinforced with a PEN film. This not only allows rework, but also improves resistance to puncture and tear. It’s highly durable and UL 94 V-0 compliant.
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Thermal conductivity: 1.3 W/m-K
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Easily compressible (shore OO 30)
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Highly durable
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UL94 V-0 compliant
Carrier type:
PEN film
Color:
Light pink
Operating temperature:
-60.0 °C - 150.0 °C
Thermal conductivity:
1.3 W/mK