Thermal GAP PAD Materials
Extremely soft, electrically insulating pad - exceptional thermal conductivity
A high performance, thermally conductive, silicone-based gap pad filler with an exceptional thermal conductivity rating of 12.0 W/m-K and ultra low modulus (ULM).
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
BERGQUIST® GAP PAD TGP 12000ULM is an extremely soft, ultra low modulus (ULM) resin material with a unique filler package, which provides excellent thermal performance at low pressures. The flexibility of the material easily conforms to rough or irregular surfaces, allowing exceptional wet-out characteristics at the interface while protective liners on both sides allow for easy application.
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Thermal conductivity: 12 W/m-K (ASTM D5470)
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Exceptional thermal performance at low pressures
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Ultra-low modulus allows for excellent adhesion to rough surfaces
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Supplied with protective liners for ease of use
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High-compliance
Operating temperature:
-60.0 °C - 200.0 °C
Thermal conductivity:
12.0 W/mK