Known as Gap Pad® VO Ultra Soft

Features and Benefits

BERGQUIST GAP PAD TGP 1000VOUS, Ultra Conformable, Thermally Conductive Material for Filling Air Gaps
BERGQUIST® GAP PAD TGP 1000VOUS is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low stress vibration dampening and shock absorbing characteristics. BERGQUIST GAP PAD TGP 1000VOUS is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.
  • Thermal conductivity: 1.0 W/m-K
  • Highly conformable, low hardness
  • "Gel-like" modulus
  • Decreased strain
  • Puncture, shear and tear resistant
  • Electrically isolating
Read More

Technical Information

Carrier Type Reinforcement Carrier: Fiberglass
Color Pink
Technology Silicone
Thermal Conductivity 1 W/mK
Thickness 0.02 - 0.25 in.
Usage Temperature -76 - 392 °F
Young's Modulus 55 KPa