arrow_down arrow_left arrow_right arrow_up burger_menu ic-checkmark close contact download edit filter Icon-GetDirections location_selector Shape Icon-GoToWebsite search neu social_facebook social_google_plus social_instagram social_linkedin social_snapchat social_twitter social_vk social_wechat social_xing social_youtube

Known as Gap Pad® HC 3.0

Features and Benefits


BERGQUIST GAP PAD TGP HC3000, High-Compliance, Thermally Conductive, Low Modulus, Fiberglass reinforced, Silicone Based Pad

BERGQUIST® GAP PAD TGP HC3000 is a soft gap filling material rated at a thermal conductivity of 3.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique 3.0 W/m-K filler package and low-modulus resin formulation. The enhanced material is well suited for high performance applications requiring low assembly stress. BERGQUIST GAP PAD TGP HC3000 maintains a conformable nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography. BERGQUIST GAP PAD TGP HC3000 is offered with natural inherent tack on one side of the material, eliminating the need for thermally-impeding adhesive layers. The top side has minimal tack for ease of handling. BERGQUIST GAP PAD TGP HC3000 is supplied with protective liners on both sides.
  • Thermal conductivity: 3.0 W/m-K
  • Silicone-free formulation
  • Minimal compression set
  • 0.5 mil film provides tack-free surface
  • Tacky side allows for ease of handling and placement
  • High performance and high compliance
Read More

Documents and Downloads

Technical Information

Carrier Type Reinforcement Carrier: Fiberglass
Color Blue
Flame Rating V-0
Technology Silicone
Thermal Conductivity 3 W/mK
Thickness Max 0.125
Thickness Min 0.02
Thickness Unit in.
Usage Temperature Max 392
Usage Temperature Min -77
Usage Temperature Unit °F
Young's Modulus 110 KPa