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      A packshot of BERGQUIST GAP PAD TGP 3500ULM showing grey sheets and die cuts.

      Thermal GAP PAD Materials

      BERGQUIST® GAP PAD TGP 3500ULM

      Soft, fiberglass reinforced electrically insulating pad

      A thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 3.5 W/m-K and ultra low modulus (ULM).

      All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
      Part no. (SKU/IDH) 2192143
      BERGQUIST GAP PAD TGP 3500ULM

      Thickness Please make your selection 0.040"

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      Technical (1)

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      Information

      BERGQUIST® GAP PAD TGP 3500ULM is an extremely soft thermal interface material with a higher natural tack, eliminating the need for additional adhesive layers and providing stick-in-place characteristics during assembly. The specially designed formulation offers excellent thermal performance at low pressures and is highly conforming, allowing for excellent wet-out at the interface.
      • Thermal conductivity: 3.5 W/m-K (ASTM D5470)
      • Fiberglass reinforced for puncture, shear, and tear resistance
      • High-compliance, low compression stress
      • Non-fiberglass option available for additional stress reduction
      • Supplied with protective liners for ease of use

      Carrier type:

      Fiberglass,Non-fiberglass

      Color:

      Gray

      Flame rating:

      V-0

      Operating temperature:

      -60.0 °C - 200.0 °C

      Standard thickness:

      0.508 mm - 3.175 mm

      Thermal conductivity:

      3.5 W/mK

      Young's modulus:

      27.5 KPa (4.0 psi)

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