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Known as Gap Pad® 3004SF

Features and Benefits


BERGQUIST GAP PAD TGP 3004SF, High Performance, Thermally Conductive Material With Silicone-Free, Polymer Pad

BERGQUIST® GAP PAD TGP 3004SF is high performance, 3.0 W/m-K, thermally conductive gap filling material. BERGQUIST GAP PAD TGP 3004SF is silicone-free by design and offers exceptionally low interfacial resistances to adjacent surfaces. BERGQUIST GAP PAD TGP 3004SF is designed for applications that are silicone-sensitive. BERGQUIST GAP PAD TGP 3004SF is constructed using a 0.25 mil PET film that provides a no tack surface on one side and natural tack on the other side.
  • Thermal Conductivity: 3.0 W/m-K
  • Silicone-free formulation
  • 0.25 mil PET provides easy disassembly, leaving no residue
  • Tacky side allows for ease of handling and placement
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Documents and Downloads

Technical Information

Carrier Type Reinforcement Carrier: 0.25 mil PET film
Color Grey: Light Grey
Flame Rating V-0
Technology Silicone
Thermal Conductivity 3 W/mK
Thickness Max 0.125
Thickness Min 0.01
Thickness Unit in.
Usage Temperature Max 257
Usage Temperature Min -41
Usage Temperature Unit °F