Known as Gap Pad® 3004SF
Features and Benefits
BERGQUIST GAP PAD TGP 3004SF, High Performance, Thermally Conductive Material With Silicone-Free, Polymer PadBERGQUIST® GAP PAD TGP 3004SF is high performance, 3.0 W/m-K, thermally conductive gap filling material. BERGQUIST GAP PAD TGP 3004SF is silicone-free by design and offers exceptionally low interfacial resistances to adjacent surfaces. BERGQUIST GAP PAD TGP 3004SF is designed for applications that are silicone-sensitive. BERGQUIST GAP PAD TGP 3004SF is constructed using a 0.25 mil PET film that provides a no tack surface on one side and natural tack on the other side.
- Thermal Conductivity: 3.0 W/m-K
- Silicone-free formulation
- 0.25 mil PET provides easy disassembly, leaving no residue
- Tacky side allows for ease of handling and placement
Documents and Downloads
Looking for a TDS or SDS in another language?
|Carrier Type||Reinforcement Carrier: 0.25 mil PET film|
|Color||Grey: Light Grey|
|Thermal Conductivity||3 W/mK|
|Usage Temperature Max||257|
|Usage Temperature Min||-41|
|Usage Temperature Unit||°F|