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BERGQUIST GAP PAD TGP 1500

Known as Gap Pad® 1500

Features and Benefits

BERGQUIST GAP PAD TGP 1500

BERGQUIST GAP PAD TGP 1500, Thermally Conductive, Un-Reinforced, Silicone Based Pad

BERGQUIST® GAP PAD TGP 1500 has an ideal filler blend that gives it a low modulus characteristic that maintains optimal thermal performance yet still allows for easy handling. The natural tack on both sides of the material allows for good compliance to adjacent surfaces of components, minimizing interfacial resistance.
  • Thermal conductivity: 1.5 W/m-K
  • Un-reinforced construction for additional compliancy
  • Conformable, low hardness
  • Electrically isolating
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Documents and Downloads

Technical Information

Color Black
Technology Silicone
Thermal Conductivity 1.5 W/mK
Thickness Max 0.2
Thickness Min 0.02
Thickness Unit in.
Usage Temperature Max 392
Usage Temperature Min -77
Usage Temperature Unit °F
Young's Modulus 310 KPa