Thermal GAP PAD Materials
Soft, electrically insulating pad - cost-effective
Thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 1.5W/mK.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
BERGQUIST® GAP PAD TGP 1500 is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.
For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
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Un-reinforced construction for additional compliancy
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Thermal conductivity: 1.5 W/m-K
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Electrically isolating
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Conformable, low hardness
Color:
Black
Operating temperature:
-60.0 °C - 200.0 °C
Standard thickness:
0.508 mm - 5.08 mm
Thermal conductivity:
1.5 W/mK
Young's modulus, ASTM D575:
310.0 KPa (45.0 psi)