Known as Gap Pad® 1500
Features and Benefits
BERGQUIST GAP PAD TGP 1500, Thermally Conductive, Un-Reinforced, Silicone Based PadBERGQUIST® GAP PAD TGP 1500 has an ideal filler blend that gives it a low modulus characteristic that maintains optimal thermal performance yet still allows for easy handling. The natural tack on both sides of the material allows for good compliance to adjacent surfaces of components, minimizing interfacial resistance.
- Thermal conductivity: 1.5 W/m-K
- Un-reinforced construction for additional compliancy
- Conformable, low hardness
- Electrically isolating
Documents and Downloads
Looking for a TDS or SDS in another language?
|Thermal Conductivity||1.5 W/mK|
|Usage Temperature Max||392|
|Usage Temperature Min||-77|
|Usage Temperature Unit||°F|
|Young's Modulus||310 KPa|