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BERGQUIST LIQUI FORM TLF 6000HG

Features and Benefits

BERGQUIST LIQUI FORM TLF 6000HG, Thermally conductive gel, Pre-cured
BERGQUIST® LIQUI FORM TLF 6000HG thermally conductive gel interface material is designed to meet the demanding requirements in certain telecom market applications. Its unique formulation assures a balanced mix of high thermal conductivity, good dispensing efficiency and high thermal reliability. This material is specially designed to provide effective electronic component cooling capability for 5G base station and remote antenna assembly where a highly reliable vertical gap stability is required. It is most effective for gaps as narrow as less than or equal to 3mm. BERGQUIST LIQUI FORM TLF 6000HG is pre-cured, requiring no mixing or refrigeration.
  • Thermal Conductivity: 6.0 W/m-K
  • Dispensable pre-cured gel
  • Stable viscosity in storage and in the application
  • Excellent chemical stability and mechanical stability
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Technical Information

Physical Form Paste
Technology Silicone

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