Thermal GAP PAD Materials
Thermally conductive, reinforced gap filler for low-stress applications
This silicone based, highly conformable, reinforced "S-Class" gap filling material is recommended for low-stress applications that require a mid to high thermally conductive interface material.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
The highly conformable nature of BERGQUIST® GAP PAD TGP 2000 means the pad can fill air voids and air gaps with stepped topography, rough surfaces, and high stack-up tolerances. It has inherent natural tack on both sides of the material, allowing for stick-in-place characteristics during application assembly. It’s supplied with protective liners on both sides, and the top side has reduced tack for ease of handling.
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Thermal Conductivity: 2.0 W/m-K
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Low "S-Class" thermal resistance at very low pressures
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Designed for low-stress applications
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Highly conformable
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Low hardness
Color:
Gray
Density:
2.9 g/cm³
Dielectric breakdown voltage:
5000.0 Vac
Dielectric constant, @ 1kHz:
6.0
Flame rating:
V-0
Heat capacity, ASTM E1269:
0.6 J/g-K
Operating temperature:
-60.0 °C - 200.0 °C
Shore hardness, Thirty second delay value, ASTM D2240, Bulk Rubber, Shore 00:
30.0
Standard thickness:
0.508 mm - 3.175 mm
Thermal conductivity:
2.0 W/mK
Volume resistivity:
1×10 Ohm m