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BERGQUIST LIQUI FORM TLF 6000HG

Features and Benefits

BERGQUIST LIQUI FORM TLF 6000HG is a silicone-based, thermally conductive, and pre-cured gel interface material specially formulated to provide a balanced mix of superior thermal reliability, good dispensing efficiency, and high thermal conductivity.
BERGQUIST® LIQUI FORM TLF 6000HG is a unique formula that effectively provides electronic component cooling capability for remote antenna assembly and 5G base stations where reliability in vertical gap stability is required. The pre-cured gel doesn’t require mixing or refrigeration and is ideal for filling narrow gaps that measure
  • Thermal conductivity: 6.0 W/m-K
  • Dispensable pre-cured gel
  • Stable viscosity in storage and in the application
  • Excellent chemical stability and mechanical stability
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Technical Information

Physical Form Paste
Technology Silicone

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