Products

Epoxy-based, composite surfacing film for lightning strike protection

One-part, halogen-free epoxy underfill for shock and drop protection

No-flow encapsulant designed for local circuit board protection 

Easily reworkable, fast-drying protection layer​ for circuit boards

Silicone-based potting compound and sealant

Reactive hotmelt adhesive system for lamination and general assembly work 

Two-part, thermally conductive epoxy encapsulant

Heat- and humidity resistant, solvent-free potting adhesive 

Two-part, thermally conductive epoxy encapsulant

Curing agent/hardener for use with potting and encapsulating resins

Thermally conductive, 2-part epoxy encapsulant

Low viscosity, low abrasion, general-purpose filled encapsulant