BERGQUIST LIQUI FORM TLF 10000 Specially designed for the Data & Telecom Market
Features and Benefits
Available sizes:
BERGQUIST LIQUI FORM TLF 10000 is a thermally conductive gel interface material designed for high power industrial infrastructure electronics systems.
BERGQUIST® LIQUI FORM TLF 10000 thermally conductive gel interface material is designed to meet the demanding requirements in telecom market applications. Its unique formulation assures a balanced mix of high thermal conductivity, good dispensing efficiency and high thermal reliability. This material is specially designed to provide effective electronic component cooling capability for 5G base station and remote antenna assembly where a highly reliable vertical gap stability is required. BERGQUIST LIQUI FORM TLF 10000 is pre-cured, requiring no mixing or refrigeration.
- Thermal Conductivity, ASTM D5470, 10 W/(m-K)
- Excellent thermal cycling performance & dispense properties
- Low thermal impedance
Documents and Downloads
Safety Data Sheets and RoHs
- Other Package Types 1.0/case - IDH 2746327
- Other Package Types 16.0/case - IDH 2746330
- 1 gallon pail Open Head Pail with Lid 1.0/case - IDH 2796659
BERGQUIST LIQUID FORM TLF 10000, 0.8 GALLON 2746327 en-US
IDH:
2746327
Size Case: Other Package Types
Quantity: 1.0/case
BERGQUIST LIQUID FORM TLF 10000, 150CC 2746330 en-US
IDH:
2746330
Size Case: Other Package Types
Quantity: 16.0/case
BERGQUIST LIQUID FORM TLF 10000, 13KG 2796659 en-US
IDH:
2796659
Size Case: 1 gallon pail Open Head Pail with Lid
Quantity: 1.0/case
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BERGQUIST LIQUI FORM TLF 10000
BERGQUIST LIQUI FORM TLF 10000 is a thermally conductive gel interface material designed for high power industrial infrastructure electronics systems.