Thermal gels
High performance, telecom market applications
A one-part, red, silicone-based, fully cured thermal interface gel designed for high power industrial infrastructure electronics systems.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
2746330
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- Description
- Technical specification
BERGQUIST® LIQUI FORM TLF 10000 is a thermally conductive, dispensable, highly conformable gel thermal interface material designed to meet the demanding requirements for datacom, telecom, and industrial automation applications. Its unique formulation delivers a balanced mix of high thermal conductivity, dispensing efficiency, and high reliability. This material is designed to provide efficient heat transfer between high-power electronic components and heat sinks. Recognized for its importance in optimizing electronics performance, the high thermal conductivity gel has won several industry awards.
For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
Flame rating:
V-0
Operating temperature:
-60.0 °C - 200.0 °C
Shelf life, @ 0.0 °C:
180.0 day
Thermal conductivity:
10.0 W/mK
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