BERGQUIST® LIQUI FORM TLF 10000 Specially designed for the Data & Telecom Market
Features and Benefits
Available sizes:
A one-part, red, silicone-based, fully cured thermal interface gel designed for high power industrial infrastructure electronics systems.
BERGQUIST® LIQUI FORM TLF 10000 is a thermally conductive, dispensable, highly conformable gel thermal interface material designed to meet the demanding requirements for datacom, telecom, and industrial automation applications. Its unique formulation delivers a balanced mix of high thermal conductivity, dispensing efficiency, and high reliability. This material is designed to provide efficient heat transfer between high-power electronic components and heat sinks. Recognized for its importance in optimizing electronics performance, the high thermal conductivity gel has won several industry awards. For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
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Documents and Downloads
Safety Data Sheets and RoHs
- 1.0/case - IDH 2746327
- 16.0/case - IDH 2746330
- Pail 1.0/case - IDH 2796659
BERGQUIST® LIQUI FORM TLF 10000 2746327 en-US
IDH:
2746327
Quantity: 1.0/case
BERGQUIST® LIQUI FORM TLF 10000 2746330 en-US
IDH:
2746330
Quantity: 16.0/case
BERGQUIST® LIQUI FORM TLF 10000, 1 gallon pail Pail 2796659 en-US
IDH:
2796659
Size Case: Pail
Quantity: 1.0/case
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Additional Documents
Technical Information
Flame rating | V-0 |
Operating temperature | -60.0 - 200.0 °C |
Shelf life, @ 0.0 - 35.0 °C | 180.0 day |
Thermal conductivity | 10.0 W/mK |