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BERGQUIST® LIQUI FORM TLF 10000 Specially designed for the Data & Telecom Market

Features and Benefits

A one-part, red, silicone-based, fully cured thermal interface gel designed for high power industrial infrastructure electronics systems.
BERGQUIST® LIQUI FORM TLF 10000 is a thermally conductive, dispensable, highly conformable gel thermal interface material designed to meet the demanding requirements for datacom, telecom, and industrial automation applications. Its unique formulation delivers a balanced mix of high thermal conductivity, dispensing efficiency, and high reliability. This material is designed to provide efficient heat transfer between high-power electronic components and heat sinks. Recognized for its importance in optimizing electronics performance, the high thermal conductivity gel has won several industry awards. For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
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Documents and Downloads

Safety Data Sheets and RoHs
BERGQUIST® LIQUI FORM TLF 10000 2746327 en-US
IDH: 2746327

Quantity: 1.0/case

BERGQUIST® LIQUI FORM TLF 10000 2746330 en-US
IDH: 2746330

Quantity: 16.0/case

BERGQUIST® LIQUI FORM TLF 10000, 1 gallon pail Pail 2796659 en-US
IDH: 2796659

Size Case: Pail

Quantity: 1.0/case

No documents found

Technical Information

Flame rating V-0
Operating temperature -60.0 - 200.0 °C
Shelf life, @ 0.0 - 35.0 °C 180.0 day
Thermal conductivity 10.0 W/mK

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