BERGQUIST GAP PAD TGP HC3000

Known as Gap Pad® HC 3.0

Features and Benefits

BERGQUIST GAP PAD TGP HC3000, High-Compliance, Thermally Conductive, Low Modulus, Fiberglass reinforced, Silicone Based Pad
BERGQUIST® GAP PAD TGP HC3000 is a soft gap filling material rated at a thermal conductivity of 3.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique 3.0 W/m-K filler package and low-modulus resin formulation. The enhanced material is well suited for high performance applications requiring low assembly stress. BERGQUIST GAP PAD TGP HC3000 maintains a conformable nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography. BERGQUIST GAP PAD TGP HC3000 is offered with natural inherent tack on one side of the material, eliminating the need for thermally-impeding adhesive layers. The top side has minimal tack for ease of handling. BERGQUIST GAP PAD TGP HC3000 is supplied with protective liners on both sides.
  • Thermal conductivity: 3.0 W/m-K
  • Silicone-free formulation
  • Minimal compression set
  • 0.5 mil film provides tack-free surface
  • Tacky side allows for ease of handling and placement
  • High performance and high compliance
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Technical Information

Carrier Type Reinforcement Carrier: Fiberglass
Color Blue
Flame Rating V-0
Technology Silicone
Thermal Conductivity 0.3 W/mK
Thickness 0.02 - 0.12 in.
Usage Temperature -76 - 392 °F
Young's Modulus 110 KPa