Thermal gap fillers
High performance gap-filler for e-mobility battery applications
A highly thermally-conductive liquid gap filler for easy, fast dispensing and low stress assembly. Ideal for high throughput applications like automotive power storage systems in the automotive industry.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
When you need a combination of excellent thermal conductivity, high dispense rate and low compressive stress, BERGQUIST® GAP FILLER TGF 3010APS is an excellent fit. This specially-formulated silicone-free, 2-part gap filler offers a dispense rate of up to 80 cc/sec, a 3.0 W/m-K thermal performance, and cures at room temperature. It is designed for silicone sensitive application to have low stress, avoiding damage during battery module assembly.
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Silicone-free
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Very high dispense rate
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Low compression force
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Room temperature cure
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High thermal conductivity of 3 W/mK
Cure type:
Heat cure
Flame rating:
V-0
Hardener: Color:
White
Mixed: Color:
Black
Operating temperature:
-40.0 °C - 80.0 °C
Resin: Color:
Black
Thermal conductivity:
3.0 W/mK