LOCTITE GC 50 Solder Paste

It is a Halogen-free dispensable grade no-clean solder paste with excellent room temperature stability. The paste is specifically formulated for jet dispensing. It is available with SAC305 alloy in Type 5 powder size. LOCTITE GC 50 is available in standard EFD and Iwashita cartridges.

LOCTITE GC 50 solder paste can be left in the ejector head for 2 weeks at room temperature 5-25°C (41-77°F) or inside the machine at 28°C for 1 week.

LOCTITE GC 50 is suitable for use in a time/pressure with a minimum 0.20mm (27 gauge) internal diameter needle.

LOCTITE GC 50 is classified as ROL0 when tested per ANSI/J-STD-004 Rev. B.

LOCTITE GC 50 has a shelf life of 6 months when stored at 5-25°C (41-77°F).

LOCTITE GC 50 is compatible with all typical electronic grade metallization’s including OSP copper, tin, ENIG, silver and others.

LOCTITE GC 50 is compatible with a variety of reflow profiles. Basic information and examples of typical profiles are provided on the technical data sheet. Further details are available in the product specific engineering manual.

Yes, the post reflow residues are easily cleaned using commercially available solvent systems and equipment. Detailed recommendations are available upon request.

LOCTITE GC 50 has been tested with other LOCTITE solder pastes and been shown to be compatible. Details can be found in the product specific engineering manual.