Request a sample of our LOCTITE GC 50 Solder Paste

Try our LOCTITE GC 50 Solder Paste for yourself to see if it meets your business needs.

Request a Sample

LOCTITE GC 50 Solder Paste

Name: LOCTITE GC 50
Brand: LOCTITE

Features and Benefits

TDS Download

LOCTITE GC 50, Solder Paste, Halogen-free, Pb-free soldering

LOCTITE® GC 50 solder paste is a halogen free, no-clean, Pb-free solder paste specially specially designed to provide enhanced stability when used in jetting and other dispensing applications. Please refer to the TDS for options and configurations.

Provides added long-term stability over a wide range of temperature conditions. Cpk >2.0 achievable with less than 50% tolerance
Optimized rheology suitable for solder paste jetting technology with process stability up to 28°C (82°F)
Good resistance to graping in demanding reflow profiles
Post reflow residues readily removed with electronics industry solvents

Documents and Downloads

Download TDS

Looking for a TDS or SDS in another language?

Search for TDS in another language

Search for SDS in another language

Additional Documents

Sell Sheet: LOCTITE GC 50

Download Document

English

Engineering Manual: LOCTITE GC 50

Download Document

English

Statistical Process Control: LOCTITE GC 50

Download Document

English

Handling Guidelines: LOCTITE GC 50

Download Document

English

Cleaning Report: LOCTITE GC 50 using ZESTRON cleaners

Download Document

English

Temperature Indicator Labels: LOCTITE GC 50

Download Document

English

Technical Report: LOCTITE GC 50 by KYZEN

Download Document

English

Technical Information

Shelf Life Time	180 day
Storage Temperature	41 - 77 °F

Frequently Asked Questions

It is a Halogen-free dispensable grade no-clean solder paste with excellent room temperature stability. The paste is specifically formulated for jet dispensing. It is available with SAC305 alloy in Type 5 powder size. LOCTITE GC 50 is available in standard EFD and Iwashita cartridges.

LOCTITE GC 50 solder paste can be left in the ejector head for 2 weeks at room temperature 5-25°C (41-77°F) or inside the machine at 28°C for 1 week.

LOCTITE GC 50 is compatible with all typical electronic grade metallization’s including OSP copper, tin, ENIG, silver and others.

LOCTITE GC 50 is compatible with a variety of reflow profiles. Basic information and examples of typical profiles are provided on the technical data sheet. Further details are available in the product specific engineering manual.

LOCTITE GC 50 has been tested with other LOCTITE solder pastes and been shown to be compatible. Details can be found in the product specific engineering manual.

Request a Sample

There are some errors, please correct them below

Salutation

Ms. / Mrs.

Mr.

This field is required

First Name

This field is required

Last Name

This field is required

Company Email Address

This field is required

This field is invalid

Company

This field is required

Street/House Number

This field is required

Company Post Code

This field is required

City

This field is required

Phone (Optional)

Industry

Market Segment

Technology

Market Segment

Application Details

This field is required

Keep in touch with us.

Receive information of offers and products from Henkel:

Yes, I would like to receive information on products, services and other offers regarding Henkel’s services and products. An overview of Henkel’s product categories and brands can be found here . Further information sent to you may encompass training opportunities including webinars and other events, as well as helpful articles and information including whitepapers, brochures, and other helpful material, news and interesting insights and stories.

Please agree to receive information of offers and products from Henkel

Personalization based on personal interests:

Yes, I would like Henkel to process my interactions with marketing content, my usage of Henkel websites, messages and other communication with Henkel in order to assess my interest in its products and services and personalize all communication with me. This will enable Henkel to tailor all its communication with me to my particular interests. However, Henkel will only contact me, if I have given the respective consent to receiving E-Mails above.

You must agree with the terms and conditions

I can withdraw my consent at any time with effect for the future. Withdrawal of consent will not affect the lawfulness of data processing carried out before the withdrawal. Further information about the data processing can be found in the Privacy Policy below.

LOCTITE GC 50 Solder Paste

Features and Benefits

Documents and Downloads

Looking for a TDS or SDS in another language?

Additional Documents

Technical Information

Frequently Asked Questions

What are the main features of LOCTITE GC 50?

Can LOCTITE GC 50 be left in the ejector head?

Can LOCTITE GC 50 be used in a time/pressure system?

What is the flux type and classification of LOCTITE GC 50?

What is the paste storage conditions and shelf life?

What are the recommended board pad termination types?

What is the recommended reflow process window for LOCTITE GC 50?

Is LOCTITE GC 50 suitable for use with other solder pastes?

Request a Sample