Potting compounds
Thermally conductive, 2-part epoxy encapsulant
Heat-resistant, epoxy-based encapsulant for potting electronic components exposed to harsh environments.
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- Description
- Technical specification
For a low-CTE epoxy encapsulant that can be used with a variety of catalysts, we recommend LOCTITE® STYCAST 2762FT. This black, room temperature-curing epoxy resin is ideal for potting electronic components exposed to demanding and harsh environments. It's also proven perfect for use on large, complex castings requiring high-temperature resistance and thermal conductivity. LOCTITE® STYCAST 2762FT is a 2-part product fit for use with a variety of LOCTITE® catalysts. We always recommend contacting a local technical service representative for assistance on mixed properties.
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High thermal conductivity
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Low coefficient of thermal expansion (CTE)
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High-temperature and chemical resistance
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Compatible with a variety of LOCTITE® catalysts
Applications:
Encapsulating
Color:
Black
Cure type:
Room temperature (ambient) cure
Mixed: Viscosity, Brookfield:
150000.0 mPa·s (cP)
Number of components:
2 part