arrow_down arrow_left arrow_right arrow_up burger_menu ic-checkmark close contact download edit filter location_selector search neu social_facebook social_google_plus social_instagram social_linkedin social_snapchat social_twitter social_vk social_wechat social_xing social_youtube
LOCTITE ABLESTIK 8008MD

ABLECOAT 8008MD (31G),

Features and Benefits

LOCTITE ABLESTIK 8008MD

LOCTITE® ABLESTIK 8008MD adhesive is designed for medium die attach applications. This material can be applied to a wafer backside by stencil printing and then B-staged in an oven. The adhesive can then be cured after die attach in an in-line process. This material was originally released as RP-825-3C1.
  • Electrically conductive
  • Thermally conductive
  • Low modulus
  • Good substrate wetting
  • Controlled bondline thickness
Read more

Documents and Downloads

Technical Information

Application Method Dispense Equipment
Applications Die Attach
Color Silver
Cure Schedule Ramp Time (Step 1) 30
Cure Schedule Ramp Time Unit Step 1 min
Cure Schedule Temperature (Step 1) 175, 175
Cure Schedule Temperature (°C) (Step 1) 175
Cure Schedule Time (Step 1) 60
Cure Schedule Time Unit (Step 1) min.
Cure Type Heat Cure
Key Characteristics Conductivity: Electrically Conductive, Conductivity: Thermally Conductive, Modulus: Low Modulus
Number of Components 1 Part
Physical Form Paste
Shelf Life Time 12 mon.
Shelf Life °C -40
Substrates Leadframe: Copper, Leadframe: Gold, Leadframe: Silver
Technology Hybrid Chemistry