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Known as ABLECOAT 8008MD (31G),

Features and Benefits


LOCTITE ABLESTIK 8008MD, Proprietary Hybrid Chemistry, Die Attach

LOCTITE® ABLESTIK 8008MD adhesive is designed for medium die attach applications. This material can be applied to a wafer backside by stencil printing and then B-staged in an oven. The adhesive can then be cured after die attach in an in-line process. This material was originally released as RP-825-3C1.
  • Electrically conductive
  • Thermally conductive
  • Low modulus
  • Good substrate wetting
  • Controlled bondline thickness
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Documents and Downloads

Technical Information

Applications Die Attach
Cure Schedule Temperature (Step 1) 175
Cure Type Heat Cure
Hot Die Shear Strength 2.7 kg-f
Maximum Extractable Cl- Content 9 ppm
Maximum Extractable K+ Content 9 ppm
Maximum Extractable Na+ Content 9 ppm
Shelf Life Temperature -40 °C
Substrates LeadFrame: Gold, LeadFrame: Silver
Tensile Modulus 1050 MPa
Tensile Modulus Temperature 150 °C