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ABLECOAT 8008MD (31G),

Features and Benefits


LOCTITE® ABLESTIK 8008MD adhesive is designed for medium die attach applications. This material can be applied to a wafer backside by stencil printing and then B-staged in an oven. The adhesive can then be cured after die attach in an in-line process. This material was originally released as RP-825-3C1.
  • Electrically conductive
  • Thermally conductive
  • Low modulus
  • Good substrate wetting
  • Controlled bondline thickness
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Documents and Downloads

Technical Information

Application Method Dispense Equipment
Applications Die Attach
Color Silver
Cure Schedule Ramp Time (Step 1) 30
Cure Schedule Ramp Time Unit Step 1 min
Cure Schedule Temperature (Step 1) 175, 175
Cure Schedule Temperature (°C) (Step 1) 175
Cure Schedule Time (Step 1) 60
Cure Schedule Time Unit (Step 1) min.
Cure Type Heat Cure
Key Characteristics Conductivity: Electrically Conductive, Conductivity: Thermally Conductive, Modulus: Low Modulus
Number of Components 1 Part
Physical Form Paste
Shelf Life Time 12 mon.
Shelf Life °C -40
Substrates Leadframe: Copper, Leadframe: Gold, Leadframe: Silver
Technology Hybrid Chemistry