Hot melt adhesives
Polyamide-based hot melt adhesive for encapsulation applications
One-part, polyamide-based hot melt adhesive for thermoplastic molding compound applications.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
When you want a thermoplastic hotmelt where streamlined manufacturing and end-product protection are needed, TECHNOMELT® PA 6208 N BLACK is an ideal choice. This polyamide-based adhesive is ideal for encapsulation applications, and offers simplified processing. It is compatible with a variety of substrates, including metals and ABS plastic, and has an operating temperature range between -40°C to 100°C (-40 to 212°F) depending on the application – and without mechanical stress. TECHNOMELT® PA 6208 N BLACK meets UL Flammability Rating UL 94 V-0.
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Compatible with a variety of substrates
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Operating temperature range: -40°C to 100°C (-40°F to 212°F)
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1-part: no mixing required
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Meets UL Flammability Rating UL 94 V-0
Color:
Black
Density:
0.98 g/cm³
Melt viscosity, @ 210.0 °C:
2400.0 mPa·s - 4000.0 mPa·s
Softening point temperature:
155.0 °C